Small Cream Solder Printing Machine TSP-700V
Achieves a line tact of 9 seconds. The clamping performance of the substrate is improved by edge clamping all around the substrate outline. Enhanced cleaning performance. Space-saving design.
The "Compact Cream Solder Printing Machine TSP-700V" is designed with a focus on space-saving and excellent area productivity. Its cleaning capability has also been improved, and by using a TH squeegee, it achieves high filling performance. It can perform high-speed printing at a squeegee speed of 200 mm/s. The automatic arrangement of support pins allows for the automation of the process of raising support pins, achieving zero mistakes. Additionally, data can be created offline in advance (data creation time: approximately 5 minutes). For more details, please download the catalog or contact us.
- Company:トーヨーコーポレーション 東京営業部 東京営業3課
- Price:Other